IBM has established a chip assembling process that produces chips that are up to 15% more energy efficient than the most advanced traditional chips.
The process consists of insulating tiny wires by allowing them to assemble themselves around air gaps. This advance could make next generation chips dramatically faster and more energy efficient, IBM said. Electrical signals could also flow up to 35 percent faster, potentially leading to additional advances in computing power and speed.
IBM is hoping to start using the technique as soon as 2009 on its own chips, the company said.
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